74HC273; 74HCT273
NXP Semiconductors
Octal D-type flip-flop with reset; positive-edge trigger
5. Pinning information
5.1 Pinning
74HC273
74HCT273
terminal 1
index area
74HC273
74HCT273
2
3
4
5
6
7
8
9
19
18
17
16
15
14
13
12
Q0
D0
D1
Q1
Q2
D2
D3
Q3
Q7
D7
D6
Q6
Q5
D5
D4
Q4
1
2
20
19
18
17
16
15
14
13
12
11
MR
Q0
V
CC
Q7
D7
D6
Q6
Q5
D5
D4
Q4
CP
3
D0
4
D1
5
Q1
(1)
6
GND
Q2
7
D2
8
D3
9
Q3
001aae054
10
GND
Transparent top view
001aae053
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 5. Pin configuration DIP20, SO20, SSOP20 and
TSSOP20
Fig 6. Pin configuration DHVQFN20
5.2 Pin description
Table 2.
Symbol
MR
Pin description
Pin
Description
1
master reset input (active LOW)
flip-flop output
Q0, Q1, Q2, Q3, Q4, Q5, Q6, Q7
2, 5, 6, 9, 12, 15, 16, 19
D0, D1, D2, D3, D4, D5, D6, D7
3, 4, 7, 8, 13, 14, 17, 18
data input
GND
CP
10
11
20
ground (0 V)
clock input (LOW-to-HIGH, edge-triggered)
supply voltage
VCC
74HC_HCT273
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 10 June 2013
4 of 21
NXP [ NXP ]
