74HC244; 74HCT244
Philips Semiconductors
Octal buffer/line driver; 3-state
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
∑(CL × VCC2 × fo) = sum of outputs.
4. Ordering information
Table 2:
Type number Package
Temperature range Name
Ordering information
Description
Version
74HC244
74HC244N
74HC244D
−40 °C to +125 °C
−40 °C to +125 °C
DIP20
SO20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
SOT163-1
plastic small outline package; 20 leads;
body width 7.5 mm
74HC244DB
−40 °C to +125 °C
SSOP20
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
SOT360-1
SOT764-1
74HC244PW −40 °C to +125 °C
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
74HC244BQ
−40 °C to +125 °C
DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5 × 4.5 × 0.85 mm
74HCT244
74HCT244N
74HCT244D
−40 °C to +125 °C
−40 °C to +125 °C
DIP20
SO20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
SOT163-1
plastic small outline package; 20 leads;
body width 7.5 mm
74HCT244DB −40 °C to +125 °C
74HCT244PW −40 °C to +125 °C
74HCT244BQ −40 °C to +125 °C
SSOP20
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
SOT360-1
SOT764-1
TSSOP20
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5 × 4.5 × 0.85 mm
74HC_HCT244_3
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 22 December 2005
2 of 22
NXP [ NXP ]
