74HC245; 74HCT245
Philips Semiconductors
Octal bus tranceiver; 3-state
Table 1:
Quick reference data …continued
GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns.
Symbol
CI
Parameter
Conditions
Min
Typ
3.5
10
Max
Unit
pF
input capacitance
input/output capacitance
-
-
-
-
-
-
CI/O
pF
[1]
CPD
power dissipation
capacitance per
transceiver
VI = GND to
30
pF
VCC − 1.5 V
[1] CPD is used to determine the dynamic power dissipation (PD in µW):
PD = CPD × VCC2 × fi × N + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
∑ (CL × VCC2 × fo) = sum of outputs.
4. Ordering information
Table 2:
Ordering information
Type number
Package
Temperature range Name
Description
Version
74HC245N
74HC245D
−40 °C to +125 °C
−40 °C to +125 °C
DIP20
SO20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
SOT163-1
plastic small outline package; 20 leads;
body width 7.5 mm
74HC245PW
74HC245DB
74HC245BQ
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
TSSOP20
SSOP20
plastic thin shrink small outline package; 20 leads; SOT360-1
body width 4.4 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
DHVQFN20 plastic dual-in-line compatible thermal enhanced
very thin quad flat package no leads; 20 terminals;
body 2.5 × 4.5 × 0.85 mm
SOT764-1
74HCT245N
74HCT245D
−40 °C to +125 °C
−40 °C to +125 °C
DIP20
SO20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
SOT163-1
plastic small outline package; 20 leads;
body width 7.5 mm
74HCT245PW
74HCT245DB
74HCT245BQ
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
TSSOP20
SSOP20
plastic thin shrink small outline package; 20 leads; SOT360-1
body width 4.4 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
DHVQFN20 plastic dual-in-line compatible thermal enhanced
very thin quad flat package no leads; 20 terminals;
body 2.5 × 4.5 × 0.85 mm
SOT764-1
9397 750 14502
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 31 January 2005
2 of 22
NXP [ NXP ]
