NXP Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
5. Pinning information
5.1 Pinning
74HC244
74HCT244
1OE
1A0
2Y0
1A1
2Y1
1A2
2Y2
1A3
2Y3
1
2
3
4
5
6
7
8
9
20 V
CC
19 2OE
18 1Y0
17 2A0
16 1Y1
15 2A1
14 1Y2
13 2A2
12 1Y3
11 2A3
001aae011
74HC244
74HCT244
1OE
2
3
4
5
6
7
8
9
GND 10
2A3 11
GND
(1)
1
terminal 1
index area
1A0
2Y0
1A1
2Y1
1A2
2Y2
1A3
2Y3
20 V
CC
19 2OE
18 1Y0
17 2A0
16 1Y1
15 2A1
14 1Y2
13 2A2
12 1Y3
GND 10
001aae012
Transparent top view
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 4.
Pin configuration DIP20, SO20, (T)SSOP20
Fig 5.
Pin configuration DHVQFN20
5.2 Pin description
Table 2.
Symbol
1OE, 2OE
1A0, 1A1, 1A2, 1A3
2Y0, 2Y1, 2Y2, 2Y3
GND
2A0, 2A1, 2A2, 2A3
1Y0, 1Y1, 1Y2, 1Y3
V
CC
Pin description
Pin
1, 19
2, 4, 6, 8
3, 5, 7, 9
10
17, 15, 13, 11
18, 16, 14, 12
20
Description
output enable input (active LOW)
data input
bus output
ground (0 V)
data input
bus output
supply voltage
74HC_HCT244
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 24 September 2012
3 of 18
PHILIPS [ NXP SEMICONDUCTORS ]
