NXP Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
12. Package outline
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
D
seating plane
M
E
A
2
A
L
A
1
c
Z
e
b
1
b
20
11
M
H
w
M
(e
1
)
pin 1 index
E
1
10
0
5
scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
A
max.
4.2
0.17
A
1
min.
0.51
0.02
A
2
max.
3.2
0.13
b
1.73
1.30
0.068
0.051
b
1
0.53
0.38
0.021
0.015
c
0.36
0.23
0.014
0.009
D
(1)
E
(1)
e
2.54
0.1
e
1
7.62
0.3
L
3.60
3.05
0.14
0.12
M
E
8.25
7.80
0.32
0.31
M
H
10.0
8.3
0.39
0.33
w
0.254
0.01
Z
(1)
max.
2
0.078
26.92
26.54
1.060
1.045
6.40
6.22
0.25
0.24
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT146-1
REFERENCES
IEC
JEDEC
MS-001
JEITA
SC-603
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 9.
74HC_HCT244
Package outline SOT146-1 (DIP20)
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 24 September 2012
10 of 18
PHILIPS [ NXP SEMICONDUCTORS ]
