74HC138; 74HCT138
Philips Semiconductors
3-to-8 line decoder/demultiplexer; inverting
3. Quick reference data
Table 1:
Quick reference data
GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns.
Symbol Parameter
74HC138
Conditions
Min
Typ
Max
Unit
tPHL
tPLH
,
propagation delay
An to Yn
VCC = 5 V; CL = 15 pF
-
-
-
-
-
12
14
14
3.5
67
-
-
-
-
-
ns
ns
ns
pF
pF
E3 to Yn
En to Yn
Ci
input capacitance
[1]
CPD
power dissipation
capacitance
VI = GND to VCC
74HCT138
tPHL
tPLH
,
propagation delay
An to Yn
VCC = 5 V; CL = 15 pF
-
-
-
-
-
17
19
19
3.5
67
-
-
-
-
-
ns
ns
ns
pF
pF
E3 to Yn
En to Yn
Ci
input capacitance
[1]
CPD
power dissipation
capacitance
VI = GND to (VCC − 1.5 V)
[1] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of the outputs.
4. Ordering information
Table 2:
Ordering information
Type number
Package
Temperature range Name
Description
Version
74HC138
74HC138N
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
DIP16
plastic dual in-line package; 16 leads (300 mil); SOT38-1
long body
74HC138D
SO16
plastic small outline package; 16 leads;
body width 3.9 mm
SOT109-1
SOT338-1
SOT403-1
74HC138DB
74HC138PW
74HC138BQ
SSOP16
TSSOP16
plastic shrink small outline package; 16 leads;
body width 5.3 mm
plastic thin shrink small outline package;
16 leads; body width 4.4 mm
DHVQFN16 plastic dual in-line compatible thermal enhanced SOT763-1
very thin quad flat package; no leads;
16 terminals; body 2.5 × 3.5 × 0.85 mm
74HC_HCT138_3
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 23 December 2005
2 of 23
NXP [ NXP ]
