Philips Semiconductors
Product specification
Hex inverter
74HC04; 74HCT04
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
E
v
M
A
Z
14
8
Q
A
2
pin 1 index
A
1
θ
L
p
L
(A
3
)
A
1
e
b
p
7
w
M
detail X
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max.
1.1
A
1
0.15
0.05
A
2
0.95
0.80
A
3
0.25
b
p
0.30
0.19
c
0.2
0.1
D
(1)
5.1
4.9
E
(2)
4.5
4.3
e
0.65
H
E
6.6
6.2
L
1
L
p
0.75
0.50
Q
0.4
0.3
v
0.2
w
0.13
y
0.1
Z
(1)
0.72
0.38
θ
8
0
o
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
REFERENCES
IEC
JEDEC
MO-153
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
2003 Jul 23
17
PHILIPS [ NXP SEMICONDUCTORS ]
