Philips Semiconductors
Product specification
Quad buffers (3-State)
74F125, 74F126
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
V
CC
V
IH
V
IL
I
IK
I
OH
I
OL
T
amb
Supply voltage
High-level input voltage
Low-level input voltage
Input clamp current
High-level output current
Low-level output current
Operating free air temperature range
0
PARAMETER
MIN
4.5
2.0
0.8
–18
–15
64
+70
NOM
5.0
MAX
5.5
V
V
V
mA
mA
mA
°C
UNIT
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST CONDITIONS
1
MIN
I
O
= 3mA
OH
=–3mA
±10%V
CC
±5%V
CC
±10%V
CC
±5%V
CC
±10%V
CC
I
O
= MAX
OH
±5%V
CC
0.42
–0.73
2.4
2.7
2.0
2.0
0.55
0.55
–1.2
100
20
–20
50
–50
–100
OEn = GND, Dn = 4.5V
V
CC
= MAX
OEn = Dn = GND
OEn = Dn = 4.5V
OEn = Dn = 4.5V
V
CC
= MAX
OEn = 4.5V, Dn = GND
OEn = GND, Dn = 4.5V
17
28
25
20
32
26
–225
24
40
35
30
48
39
3.3
LIMITS
TYP
2
UNIT
MAX
V
V
V
V
V
V
V
µA
µA
µA
µA
µA
mA
mA
mA
mA
mA
mA
mA
V
O
OH
High-level
High level output voltage
V
CC
= MIN,
V
IL
= MAX,
MAX
V
IH
= MIN
I
O
= 15mA
OH
=–15mA
V
O
OL
V
IK
I
I
I
IH
I
IL
I
OZH
I
OZL
I
OS
Low-level
Low level output voltage
Input clamp voltage
Input current at maximum input voltage
High-level input current
Low-level input current
Off-state output current,
High-level voltage applied
Off-state output current,
Low-level voltage applied
Short circuit output current
3
I
CCH
74F125
I
CCL
I
CCZ
I
CCH
74F126
I
CCL
I
CCZ
V
CC
= MIN,
V
IL
= MAX,
MAX
V
IH
= MIN
V
CC
= MIN, I
I
= I
IK
V
CC
= 0.0V, V
I
= 7.0V
V
CC
= MAX, V
I
= 2.7V
V
CC
= MAX, V
I
= 0.5V
V
CC
= MAX, V
O
= 2.7V
V
CC
= MAX, V
O
= 0.5V
V
CC
= MAX
I
CC
Supply current (total)
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
CC
= 5V, T
amb
= 25°C.
3. Not more than one output should be shorted at a time. For testing I
OS
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
OS
tests should be performed last.
March 28, 1989
4
PHILIPS [ NXP SEMICONDUCTORS ]
