NXP Semiconductors
1PS70SB20
Schottky barrier single diode
13. Soldering
2.65
1.85
1.325
solder lands
2
solder resist
1.3
solder paste
occupied area
Dimensions in mm
2.35
0.6
(3×)
3
1
0.5
(3×)
0.55
(3×)
sot323_fr
Fig. 5.
Reflow soldering footprint for SC-70 (SOT323)
4.6
2.575
1.425
(3×)
solder lands
solder resist
occupied area
3.65 2.1
09
(2×)
1.8
Dimensions in mm
preferred transport
direction during soldering
sot323_fw
Fig. 6.
Wave soldering footprint for SC-70 (SOT323)
14. Revision history
Table 8.
Revision history
Release date
20121217
Data sheet status
Product data sheet
Change notice
-
Supersedes
1PS70SB20 v.1
Data sheet ID
1PS70SB20 v.2
1PS70SB20
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© NXP B.V. 2012. All rights reserved
Product data sheet
17 December 2012
5/9
PHILIPS [ NXP SEMICONDUCTORS ]
