Philips Semiconductors
Product specification
High-speed double diode
ELECTRICAL CHARACTERISTICS
T
j
= 25
°C
unless otherwise specified.
SYMBOL
Per diode
V
F
forward voltage
see Fig.3
I
F
= 1 mA
I
F
= 10 mA
I
F
= 50 mA
I
F
= 100 mA
I
R
reverse current
see Fig.4
V
R
= 25 V
V
R
= 80 V
V
R
= 25 V; T
j
= 150
°C
V
R
= 80 V; T
j
= 150
°C
C
d
t
rr
diode capacitance
reverse recovery time
f = 1 MHz; V
R
= 0; see Fig.5
when switched from I
F
= 10 mA to
I
R
= 10 mA; R
L
= 100
Ω;
measured at I
R
= 1 mA; see Fig.6
when switched from I
F
= 10 mA;
t
r
= 20 ns; see Fig.7
−
−
−
−
−
−
30
0.5
30
100
1.5
4
610
740
−
−
−
−
1.0
1.2
PARAMETER
CONDITIONS
TYP.
1PS302
MAX.
UNIT
mV
mV
V
V
nA
µA
µA
µA
pF
ns
V
fr
forward recovery voltage
−
1.75
V
THERMAL CHARACTERISTICS
SYMBOL
R
th j-tp
R
th j-a
Note
1. Device mounted on an FR4 printed-circuit board.
PARAMETER
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
note 1
CONDITIONS
VALUE
200
415
UNIT
K/W
K/W
1999 May 06
3
PHILIPS [ NXP SEMICONDUCTORS ]
