1011LD110B 参数 Datasheet PDF下载

6.2

Marking codes

In general, device marking includes the part number, some manufacturing information and the NXP logo. If packages

are too small for the full-length part number a shorter, coded part number – marking code – is used (where % = placeholder

for manufacturing site code). The full-length part number is always printed on the packing label on the box or bulk-pack in

which the devices are supplied.

p = made in Hong Kong

t = made in Malaysia

W = made in China

Marking code

10%

13%

20%

21%

22%

24%

25%

26%

28%

29%

30%

31%

32%

33%

34%

35%

36%

38%

39%

40%

41%

42%

47%

48%

49%

50%

1

2

2

4

4

7

7

8

8

9

9

%1V

%1W

%6G

%6J

%6K

%6N

%6S

%6W

%6X

%6Y

%7N

%8N

%AB

%BG

%E7

%E8

%E9

%EA

%EB

%EC

%ED

%M1

%M2

%M3

%M4

Final product

ON4288

ON4690

Package

Marking code

%M5

%M6

%M7

%M8

%M9

%M9

%MA

%MB

%MC

%MD

%ME

%MF

%MG

%MH

%MK

%ML

%MM

%MM

%MN

%MP

%MP

%MR

%MS

%MT

%MU

%MV

%MW

%MX

%MY

%MZ

%VA

%VB

LE

L4

LC

L3

1A

1B

1B%

1C

1C%

1N%

2A%

2E

2L

2N

4A

4K%

4L%

4W%

5K%

5W%

6F%

6K%

6W%

7K%

8K%

A1

A1

A1

A1

A2

Final product

ON4906

ON4832

ON4973

Package

Marking code

A2

A2

A2

A2%

A3

A3

A3

A3%

A5

A5%

A6%

A7%

A8

A8%

A8%

A9

AC

B3

B5%

B6

B6%

B7

B7%

B7%

B7%

BA%

BCp

C

C1%

C2%

C4%

C5%

CL

D1

D2

D2

D3

D3

D4

D5

D6

D7

D8

E1%

E1%

E1%

E1%

E2%

E2%

E2%

E3%

E6

FB

FF

FG

G2

G2%

G3%

G4%

G5%

K1

K2

Final product

ON4438

ON5023

Package

122

NXP Semiconductors RF Manual 16

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