0581B
Philips Semiconductors
Package outlines
853-0581B 06688
0.110 (2.79)
0.050 (1.27)
0.110 (2.79)
0.050 (1.27)
NOTES:
1. Controlling dimension: Inches. Millimeters are
shown in parentheses.
–E–
0.286 (7.26)
0.245 (6.22)
2. Dimension and tolerancing per ANSI Y14. 5M-1982.
3. “T”, “D”, and “E” are reference datums on the body
and include allowance for glass overrun and meniscus
on the seal line, and lid to base mismatch.
4. These dimensions measured with the leads
constrained to be perpendicular to plane T.
PIN # 1
0.100 (2.54) BSC
0.785 (19.94)
0.753 (19.13)
5. Pin numbers start with Pin #1 and continue
counterclockwise to Pin #14 when viewed
from the top.
–D–
0.070 (1.78)
0.050 (1.27)
0.175 (4.45)
0.145 (3.68)
0.320 (8.13)
0.290 (7.37)
(NOTE 4)
–T–
0.200 (5.08)
0.165 (4.19)
14-PIN (300 mils wide) CERAMIC DUAL IN-LINE (F) PACKAGE
SEATING
PLANE
0.165 (4.19)
0.125 (3.18)
0.045 (1.143)
0.020 (0.51)
BSC
0.300 (7.62)
(NOTE 4)
0.015 (0.38)
0.010 (0.25)
0.395 (10.03)
0.300 (7.62)
0.023 (0.58)
0.015 (0.38)
T
E D
0.010 (0.254)
PHILIPS [ NXP SEMICONDUCTORS ]
