PE42510A
Product Specification
Thermal Data
Though the insertion loss for this part is very low,
when handling high power RF signals, the part can get
quite hot.
Figure 12 shows the estimated power dissipation for a
given incident RF power level. Multiple curves are
presented to show the effect of poor VSWR
conditions. VSWR conditions that present short circuit
loads to the part can cause significantly more power
dissipation than with proper matching.
Figure 13 shows the estimated maximum junction
temperature of the part for similar conditions.
Note that both of these charts assume that the case
(GND slug) temperature is held at 85C. Special
consideration needs to be made in the design of the
PCB to properly dissipate the heat away from the part
and maintain the 85C maximum case temperature. It
is recommended to use best design practices for high
power QFN packages: multi-layer PCBs with thermal
vias in a thermal pad soldered to the slug of the
package. Special care also needs to be made to
alleviate solder voiding under the part.
Figure 12. Power Dissipation
2.5
1: 1 V SWR (50 Ohm Load)
2: 1 V SWR (25 Ohm Load)
Pow er Dissipated (W)
2.0
8: 1 V SWR (6. 25 Ohm Load)
20: 1 V SWR (2. 5 Ohm Load)
I NF: 1 V SWR (0 Ohm Load)
1.5
Rel i abi l i t y Li mi t
1.0
0.5
0.0
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
RF Pow er (dBm)
Figure 13. Maximum Junction Temperature
1
45
Max Junction Temperature (C)
1
40
1
35
1
30
1
25
1
20
15
1
10
1
1
05
1
00
95
90
85
30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46
1: 1 V SWR (50 Ohm Load)
2: 1 V SWR (25 Ohm Load)
8: 1 V SWR (6. 25 Ohm Load)
20: 1 V SWR (2. 5 Ohm Load)
I NF: 1 V SWR (0 Ohm Load)
Rel i abi l i t y Li mi t
Table 6. Theta JC
Parameter
Theta JC (+85°C)
Min
Typ
24.0
Max
Units
C/W
RF Power (dBm)
Note: Case temperature = 85°C
Document No. 70-0266-01
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