PE3335
Product Specification
Handling Requirements
All surface mount products which do not meet
Level 1 moisture sensitivity requirements are
processed through dry bake and pack procedure.
The necessary data is recorded on the caution
label of each shipment. Both packages for the
PE3335 are moisture sensitivity Level 3.
Level 3 Caution Label
Level and Body temperature defined by:
IPC/JEDEC-J-STD-020
The caution label should contain the following
information for Level 3 devices:
1. Calculated shelf life in sealed bag: 12 months
at <40 °C and <90% relative humidity (RH)
For Dry Bake Procedures, see:
IPC/JEDEC-J-STD-033
2. Peak package body temperature is 225 °C.
Operator must observe ESD precautions per
ESD Control Procedure and Parts Handling and
shipping Procedure.
3. After bag is opened, devices that will be
subjected to reflow solder or other high
temperature process must
a) Be mounted within 168 hours of factory
conditions <30 °C/60% RH, or
b) Be stored at <10% RH
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card is > 10% when
read at 23 ± 5 °C
b) 3a or 3b are not met
5. If baking is required, devices may be baked for
48 hours at 125 +5/-0 °C
Note: If device containers cannot be subjected to
high temperature or shorter bake times are
desired, reference IPC/JEDEC-J-STD-033 for
bake procedure.
©2005 Peregrine Semiconductor Corp. All rights reserved.
Document No. 70-0049-02 │ UltraCMOS™ RFIC Solutions
Page 12 of 15
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