Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-T690WDT-CWA-P
REV: A / 2
2、Test Items And Results
Number
of
Damaged
Reference
Standard
Test Item
Test Condition
Note
Tsld=260℃,10sec.
(Pre treatment 30
℃,70%,168hrs)
Resistance to Soldering Heat
(Reflow Soldering)
JEITA
ED-4701300 301
2times
0/50
JEITA
ED-4701300 303
Tsld=215℃,3sec.
(Lead Solder)
1time
over 95%
Solder ability (Reflow Soldering)
Thermal Shock
0/50
0/50
0/50
JEITA
ED-4701300 307
-40℃ ~ 100℃
30min. 30min.
100cycles
100cycles
JEITA
-40℃ ~ 25℃~100℃~25℃
Temperature Cycle
ED-4701100 105 30min. 5min. 30min. 5min
JEITA
ED-4701200-
201
High Temperature Storage
Ta=100℃
Ta=60 ,RH=90%
1000hrs.
0/50
0/50
JEITA
ED-4701100 103
Temperature Humidity Storage
Low Temperature Storage
℃
1000hrs.
1000hrs.
1000hrs.
JEITA
ED-4701200 202
Ta=-40
℃
0/50
0/50
Steady State Operating Life
Condition
Ta=25℃,IF=60mA
Steady State Operating Life
of High Humidity Heat
500hrs.
0/50
Ta=60℃,RH=90%,IF=60mA
7. Cleaning
Û
Û
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed
beforehand whether the solvents will dissolve the package and the resin or not.)
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
ultrasonic power and the assembled condition. Before cleaning, a pre-test should be
confirm whether any damage to the LEDS will occur.
Û
8.Others:
The appearance and specifications of the product may be modified for improvement without notice.
DRAWING NO. : DS-31P-11-0036
DATE : 2012-5-8
PAGE
15 of 15
PARA-FOR-068