ꢀ
SURFACE MOUNT DEVICE LED
Part No. : LT670WDT-NW1
REV: A / 1
4. Lead-Free Soldering
For Reflow Soldering :
ꢀ
R
1 Pre-Heat Temp: 150-180 ,120sec.Max.
ꢀ
R
2 Soldering Temp: Temperature Of Soldering Pot Over 240 ,40sec.Max.
ꢀ
ꢁ Rꢂ
3 Peak Temperature: 2 0
10sec.
ꢀ
4 Reflow Repetition: 2 Times Max.
ꢀ
5 Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
ꢀ
1 Iron Tip Temp: 350
R
Max.
ꢀ
2 Soldering Iron: 30w Max.
ꢀ
3 Soldering Time: 3 Sec. Max. One Time.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6. Reliability
Criteria For Judging The Damage
1
3
Criteria for Judgement
MIN. Max.
U.S.L.*)
Item
Symbol
Test Conditions
Forward Voltage
Reverse Current
VF
IR
IF=20mA
VR=5V
-
ꢃ
1.1
2.0
-
ꢃ
L.S.L**) 0.7
U.S.L.*)
ꢃ
Luminous Intensity
IV
IF=20mA
-
ꢂꢄU.S.L.: Upper Standard Level
**) L.S.L: Lower Standard Level
ꢀ
DRAWING NO. :DS-7A-11-0011
DATE : 2011-6-17 PAGE
14 of 16
PARA-FOR-068
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
