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L-T670WDT-NW5-P 参数 Datasheet PDF下载

L-T670WDT-NW5-P图片预览
型号: L-T670WDT-NW5-P
PDF下载: 下载PDF文件 查看货源
内容描述: [SURFACE MOUNT DEVICE LED]
分类和应用:
文件页数/大小: 17 页 / 358 K
品牌: PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
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Release by  
PARALIGHT DCC  
SURFACE MOUNT DEVICE LED  
Part No. : LT670WDT-NW5-P  
REV: A / 0  
4. Lead-Free Soldering  
For Reflow Soldering :  
1 Pre-Heat Temp: 150-180 ,120sec.Max.  
2 Soldering Temp: Temperature Of Soldering Pot Over 240 ,40sec.Max.  
6 ℃,  
3 Peak Temperature: 2 0  
10sec.  
4 Reflow Repetition: 2 Times Max.  
5 Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu  
For Soldering Iron (Not Recommended) :  
1 Iron Tip Temp: 350 Max.  
2 Soldering Iron: 30w Max.  
3 Soldering Time: 3 Sec. Max. One Time.  
5. Drive Method  
Circuit model A  
Circuit model B  
(A)Recommended circuit.  
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.  
6. Reliability  
1 Criteria For Judging The Damage  
Criteria for Judgement  
MIN. Max.  
U.S.L.*) 1.1  
Item  
Symbol  
Test Conditions  
Forward Voltage  
Reverse Current  
VF  
IR  
IF=20mA  
VR=5V  
-
-
×
U.S.L.*) 2.0  
×
Luminous Intensity  
IV  
IF=20mA  
L.S.L**) 0.7  
×
-
U.S.L.: Upper Standard Level  
*)  
**) L.S.L: Lower Standard Level  
DRAWING NO. : DS-7A-11-0017  
DATE : 2011-11-23  
PAGE  
15 of 17  
PARA-FOR-068  
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