ꢀ
SURFACE MOUNT DEVICE LED
Part No. : L-T670LBCT
REV: A / 4
4. Lead-Free Soldering
For Reflow Soldering :
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1 Pre-Heat Temp: 150-180R,120sec.Max.
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2 Soldering Temp: Temperature Of Soldering Pot Over 240R,40sec.Max.
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ꢁ
3 Peak Temperature: 260R 10sec.
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4 Reflow Repetition: 2 Times Max.
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5 Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
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1 Iron Tip Temp: 350R Max.
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2 Soldering Iron: 30w Max.
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3 Soldering Time: 3 Sec. Max. One Time.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6. Reliability
Criteria For Judging The Damage
1
3
Criteria for Judgement
MIN. Max.
U.S.L.*)
Item
Symbol
Test Conditions
Forward Voltage
Reverse Current
VF
IR
IF=20mA
VR=5V
-
ꢅ
1.1
2.0
-
ꢅ
L.S.L**) 0.7
U.S.L.*)
ꢅ
Luminous Intensity
IV
IF=20mA
-
ꢆꢇU.S.L.: Upper Standard Level
**) L.S.L: Lower Standard Level
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DRAWING NO. : DS-7A-07-0006
DATE : 2009-10-31
PAGE 13 of 15
PARA-FOR-068