PARA-FOR-068
SURFACE MOUNT DEVICE LED
Part No. :L-T3014XWDT
REV: A / 0
4. Lead-Free Soldering
For Reflow Soldering :
、
℃
1 Pre-Heat Temp: 150- 0 ,120sec.Max.
18
、
℃
3
2 Soldering Temp: Temperature Of Soldering Pot Over 240 , 0sec.Max.
、
6 ℃，
3 Peak Temperature: 2 0
10sec.
、
4 Reflow Repetition: 2 Times Max.
、
5 Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
、
℃
1 Iron Tip Temp: 350 Max.
、
2 Soldering Iron: 30w Max.
、
3 Soldering Time: 3 Sec. Max. One Time.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6. Reliability
1 Criteria For Judging The Damage
、
Criteria for Judgement
MIN. Max.
U.S.L.*) 1.2
Item
Symbol
Test Conditions
Forward Voltage
Reverse Current
VF
IR
IF=30mA
VR=5V
-
-
×
U.S.L.*) 2.0
×
Luminous Intensity
IV
IF=30mA
L.S.L**) 0.7
×
-
U.S.L.: Upper Standard Level
*)
**) L.S.L: Lower Standard Level
DRAWING NO. : DS-31P-12-0005
DATE : 2012-3-2 PAGE
17 of 19
PARA-FOR-068
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
