Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-S115GECT
REV:A / 0
z CAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household application).Consult PARA’s sales in advance
for information on application in which exceptional quality and reliability are required, particularly
when the failure or malfunction of the LED’s may directly jeopardize life or health (such as airplanes,
automobiles, traffic control equipment, life support system and safety devices).
2.Storage :
Before opening the package :
The LEDs should be kept at 5°C to 30°C or less and 85%RH or less. The LEDs should be used
within a year.
After opening the package :
The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where condensation
may occur.
3.Soldering(Standard Process) :
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60s Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
preformed consecutively cooling process is required between 1st and 2nd soldering processes.
DRAWING NO. : DS-78-08-0003
DATE : 2008-02-21 PAGE
12 of 15
PARA-FOR-068
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
