Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-C192JGCT
REV: A/1
4. Lead-Free Soldering
For Reflow Soldering :
、
℃
1 Pre-Heat Temp: 150-180 ,120sec.Max.
、
℃
2 Soldering Temp: Temperature Of Soldering Pot Over 230 ,40sec.Max.
、
℃,
3 Peak Temperature: 260
5sec.
、
4 Reflow Repetition: 2 Times Max.
、
5 Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
、
℃
1 Iron Tip Temp: 350 Max.
、
2 Soldering Iron: 30w Max.
、
3 Soldering Time: 3 Sec. Max. One Time.
For Dip Soldering :
、
℃
1 Pre-Heat Temp: 150 Max. 120 Sec. Max.
、
℃
2 Bath Temp: 265 Max.
、
3 Dip Time: 5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
DRAWING NO. : DS-75-08-0012
DATE : 2013-04-23
PAGE 12 of 14
PARA-FOR-068