3￠ 8x8 DOT MATRIX DISPLAY
REV:A / 0
A-3880E-EP-AH GW
—SOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
— Solder no closer than 2mm from
the base of the package
DIP
Bath temperature: 260 max
Immersion time: within 5 sec
SOLDERING
— Using soldering flux,” RESIN
FLUX” is recommended.
—During soldering, take care not to
press the tip of iron against the
PIN.
Soldering iron: 30W or smaller
Temperature at tip of iron: 260℃ or lower
Soldering time: within 5 sec.
SOLDERING
IRON
(To prevent heat from being
transferred directly to the PIN.)
1) When soldering the PIN of Display in a jig that the package is fixed with a panel (See fIg.1), be
careful not to stress the PIN with iron tip. When soldering Display in a condition that the package is
fixed with a panel, be careful not to cling and stress the surface of Display on the panel to avoid
damaging the Display.
Fig.1
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and silver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly
3 seconds.
DRAWING NO. : DS-16-11-0151G
DATE : 2011-04-14
Page : 6
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
