Chip Bead Cores
■
Construction
■
Dimensions in mm (not to scale)
L
A
L
A
W
Ferrite core
Electrode
Type
(inches)
L
Dimensions (mm)
W
H
A
Mass
(Weight)
[mg/pc.]
EXCCL4532 4.5±0.4 3.2±0.3 1.8±0.2 0.5±0.2
(1812)
EXCCL3225 3.2±0.3 2.5±0.3 1.6±0.3 0.5±0.3
(1210)
EXCCL3216 3.2±0.3 1.6±0.3 1.6±0.3 0.5±0.3
(1206)
125.8
60.5
37
■
Type: EXCML
1
●
Explanation of Part Numbers
2
3
4
5
6
7
8
9
10
11
12
E
X
Product Code
C
M
Type
L
Part kind
2
Size
0
A
Material
3
9
0
U
Form
Nominal Impedance
Noise Filter
Molded
Chip type
Bead core
Code Dimensions (mm)
45
32
20
16
4.5x1.6 x1.1
3.2x1.6 x0.9
2.0x1.25x0.9
1.6x0.8 x0.8
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
Code
U
H
Packing
Embossed Carrier Taping
(EXCML16 to 32)
Embossed Carrier Taping
(EXCML45)
■
Construction
■
Dimensions in mm (not to scale)
e
L
W
T
Ferrite core
Type
(inches)
Conductor
Electrode
L
1.6
±
0.2
Dimensions (mm)
W
T
0.8
±
0.2
0.8
±
0.2
e
(0.4)
(0.5)
(0.6)
(0.6)
Mass
(Weight)
[mg/pc.]
EXCML16
(0603)
EXCML20
(0805)
EXCML32
(1206)
EXCML45
(1806)
4.5
10.5
21.5
36.0
2.0
±
0.2 1.25
±
0.20 0.9
±
0.2
3.2
±
0.3
4.5
±
0.3
1.6
±
0.3
1.6
±
0.3
0.9
±
0.2
1.1
±
0.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Mar. 2008
PANASONIC [ PANASONIC SEMICONDUCTOR ]
