AXT3, 4
SPECIFICATIONS
1. Characteristics
Item
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Conditions
Rated current
Rated voltage
—
—
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1mA.
Breakdown voltage
Electrical
150V AC for 1 min.
Min. 1,000MΩ (initial)
Max. 90mΩ
characteristics
Using 250V DC megger
(applied for 1 min.)
Insulation resistance
Based on the contact resistance measurement method
specified by JIS C 5402.
Contact resistance
Composite insertion force
Max. 0.981N/pin contacts × pin contacts (initial)
Min. 0.0588N/pin contacts × pin contacts
Mechanical
Composite removal force
characteristics
Contact holding force
(Socket contact)
Measuring the maximum force.
As the contact is axially pull out.
Min. 0.981N/pin contacts
Ambient temperature
–55°C to +85°C
No freezing at low temperatures
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
Infrared reflow soldering
Soldering heat resistance
300°C within 5 sec. or 350°C within 3 sec.
Soldering iron
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Storage temperature
No freezing at low temperatures
Conformed to MIL-STD-202F, method 107G
Order Temperature (°C) Time (minutes)
0
1
2
3
4
–55−3
30
Max. 5
30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Thermal shock resistance
(header and socket mated)
85+3
Environmental
characteristics
0
Max. 5
0
–55−3
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Humidity resistance
(header and socket mated)
Temperature 40 2°C,
humidity 90 to 95% R.H.
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Saltwater spray resistance
(header and socket mated)
Temperature 35 2°C,
saltwater concentration 5 1%
Temperature 40 2°C,
gas concentration 3 1 ppm,
humidity 75 to 80% R.H.
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 90mΩ
Lifetime
characteristics
Repeated insertion and removal speed of
max. 200 times/hours
Insertion and removal life
50 times
Mated height 1.5mm,
20 pin contact type: Socket: 0.04 g Header: 0.02 g
Unit weight
2. Material and surface treatment
Part name
Material
Surface treatment
Molded portion
LCP resin (UL94V-0)
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)
However, the area adjacent to the socket terminal is exposed to Ni on base.
Soldering terminals portion;
Socket: Ni plating on base, Pd + Au flash plating on surface
(Expect for front edge of terminal)
Contact and Post
Copper alloy
Header: Ni plating on base, Au plating on surface
(Expect for front edge of terminal)
ACCTB14E 201303-T
Panasonic Corporation Automation Controls Business Division
industrial.panasonic.com/ac/e/
PANASONIC [ PANASONIC ]
