AXT3, 4
NOTES
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Also, to prevent connector
damage please confirm the correct
position before mating connectors.
Socket
Header
(Mated height: 1.5mm, 2.0mm, 2.5mm
and 3.0mm)
Recommended PC board pattern (TOP VIEW)
(Mated height: 1.5mm and 2.5mm)
Recommended PC board pattern (TOP VIEW)
0.95 0.03
0.70 0.03
0.80 0.03
0.45 0.03
0.23 0.03
: Insulation area
0.40 0.03
2. Keep the PC board warp no more
than 0.03mm in relation to the overall
length of the connector.
0.23 0.03
0.40 0.03
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 150 µm
(Terminal portion opening area ratio: 48%)
(Metal portion opening area ratio: 100%)
Metal mask thickness: When 150 µm
(Terminal portion opening area ratio: 49%)
(Metal portion opening area ratio: 100%)
0.80 0.01
0.45 0.01
0.95 0.01
0.70 0.01
Max. 0.03 mm
Max. 0.03 mm
3. If extra resistance to shock caused
by dropping is required, we
recommend using P4 Series.
4. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
0.20 0.01
0.40 0.01
0.20 0.01
0.40 0.01
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 120 µm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
Metal mask thickness: When 120 µm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
0.95 0.01
0.70 0.01
0.80 0.01
0.45 0.01
0.20 0.01
0.40 0.01
0.20 0.01
0.40 0.01
ACCTB14E 201303-T
Panasonic Corporation Automation Controls Business Division
industrial.panasonic.com/ac/e/
PANASONIC [ PANASONIC ]
