PAM2304
3MHz, 1A Step-Down DC-DC Converter
Pin Description
TSOT23 TDFN22-8 TDFN22-6
Name
Function
Enable control input. Force this pin voltage above 1.5V, enables
thechip, and below 0.3V shuts down the device.
Ground
1
8
4
EN
2
3
4
-
5,6
3
6
1
5
GND
SW
The drains of the internal main and synchronous power MOSFET.
VIN
Chip main power supply pin
Feedback voltage to internal error amplifier, the threshold voltage
5
1
3
FB
is 0.6V.
-
-
-
2
4
7
-
-
AGND
PGND
NC
Analog ground.
Main power ground return pin.
No connected
2
Absolute Maximum Ratings
These are stress ratings only and functional operation is not implied. Exposure to absolute
maximum ratings for prolonged time periods may affect device reliability. All voltages are with
respect to ground.
Input Voltage..................................-0.3V to 6.0V Junction Temperature................................150°C
EN, FB Pin Voltage.............................-0.3V to VIN Storage Temperature Range........-65°C to 150°C
SW Pi n Voltage.....................-0.3V to (VIN+0.3V)
Soldering Temperature......................300°C,5sec
Recommended Operating Conditions
Supply Voltage................................2.5V to 5.5V
Operation Temperature Range.........-40°C to 85°C
Junction Temperature Range........-40 °C to 125 °C
Thermal Information
Parameter
Symbol
Package
TSOT23-5Note
Maximum
Unit
130
Thermal Resistance
(Junction to Case)
θJC
TDFN22-8
TDFN22-6
TSOT23-5
23.4
25
°C/W
250
Thermal Resistance
(Junction toAmbient)
θJA
TDFN22-8
TDFN22-6
70
68
TSOT23-5
TDFN22-8
TDFN22-6
400
1400
980
Internal Power Dissipation
( TA=25°C)
PD
mW
Note:
The maximun output current for TSOT23-5 package is limited by internal power dissipation capacity as
described in Application Information hereinafter.
Power Analog Microelectronics, Inc
www.poweranalog.com
11/2011 Rev1.1
3
PAM [ POWER ANALOG MICOELECTRONICS ]
