MMSZ5221B
THRU MMSZ5262B
SSUURRFFAACCEE MMOOUUNNTT ZZEENNEERR TTYYPPEE
SOD-123F
0.110(2.80)
0.098(2.50)
0.053(1.35)
0.037(0.95)
0.154(3.90)
0.141(3.60)
Dimensions in inches and (millimeters)
FEATURES
MECHANICAL DATA
• Epoxy:UL94-VO rated flameretardant
• Up to 500mW power dissipation.
• Silicon epitaxial planarchip structure.
• Case : Moldedplastic, SOD-123F
• Wide zener reversevoltage range 2.4Vto 75V.
• Very tinypackage size forhigh density applications.
• Ideally suited forautomated assembly processes.
• Terminals: Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicatedby cathode band
• Mounting Position :Any
• Lead-free parts meetenvironmental standards of
MIL-STD-19500 /228
• Weight : Approximated 0.010gram
o
MAXIMUM RATINGS (at TA=25 C unless otherwise noted)
PARAMETER
CONDITIONS
Symbol MIN. TYP. MAX. UNIT
Forward voltage
IF = 100 mADC
1.00
V
VF
PD
Power Dissipation
500
mW
8.3ms single half sine-wave superimposed
on rate load (JEDEC methode)
Forward surge current
IFSM
4000
mA
o
Storage temperature
Operating temperature
-65
-55
+175
+150
TSTG
TJ
C
o
C
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