Version 1.3
SFH 310
Recommended Solder Pad
Dimensions in mm.
Note:
pad 1: emitter
TTW Soldering
IEC-61760-1 TTW
OHA04645
300
10 s max., max. contact time 5 s per wave
˚C
T
Continuous line: typical process
Dotted line: process limits
250
235 ˚C - 260 ˚C
First wave
Second wave
∆T < 150 K
200
150
100
50
Cooling
Preheating
ca. 3.5 K/s typical
ca. 2 K/s
130 ˚C
120 ˚C
100 ˚C
ca. 5 K/s
Typical
0
0
20
40
60
80
100
120
140
160
180
200
220 s 240
t
2016-01-04
7