Version 2.0
LE A Q9WN
Reflow Soldering Profile
Reflow Lötprofil
Preconditioning: JEDEC Level 2 acc. to J-STD-020D.01
OHA04525
300
˚C
T
250
T
245 ˚C
p
240 ˚C
tP
tL
217 ˚C
200
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s
300
t
OHA04612
Pb-Free (SnAgCu) Assembly
Profil-Charakteristik
Profile Feature
Symbol
Symbol
Einheit
Unit
Minimum
Recommendation
Maximum
Ramp-up Rate to Preheat*)
25 °C to 150 °C
2
3
K/s
Time tS
TSmin to TSmax
Ramp-up Rate to Peak*)
TSmax to TP
tS
60
100
2
120
s
3
K/s
TL
tL
Liquidus Temperature
217
°C
Time above Liquidus temperature
Peak Temperature
80
100
s
TP
tP
245
20
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
10
30
s
3
6
K/s
Ramp-down Rate*
TP to 100 °C
480
s
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
2012-06-22
13
OSRAM [ OSRAM GMBH ]
