SFH 4056
Lötbedingungen
Vorbehandlung nach JEDEC Level 3
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Preconditioning acc. to JEDEC Level 3
(nach J-STD-020-D.01)
(acc. to J-STD-020-D.01)
OHA04525
300
˚C
T
250
T
245 ˚C
p
240 ˚C
tP
tL
217 ˚C
200
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s
300
t
Pb-Free (SnAgCu) Assembly
Max. Ratings
Recommendation
Profile Feature
Ramp-up Rate to Preheat*)
25°C to 150°C
2°C / sec
3°C / sec
Time ts from TSmin to TSmax
(150°C to 200°C
100s
min. 60sec max. 120sec
3°C / sec
Ramp-up Rate to Peak*)
TSmax to TP
2°C / sec
Liquidus Temperture TL
Time tL above TL
217°C
80sec
245°C
20sec
max. 100sec
Peak Temperature TP
max. 260°C
Time tP within 5°C of the specified peak
temperature TP - 5K
min. 10sec max. 30sec
Ramp-down Rate*
TP to 100°C
3°C / sec
6°C / sec maximum
Time 25°C to Peak temperature
max. 8 min.
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation ΔT/Δt: Δt max. 5 sec; fulfillment for the whole T-range
2010-11-09
8
OSRAM [ OSRAM GMBH ]
