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CE & Discharge Function Selection Table
EEE
CODE
NHF
NLF
NHN
NLN
UHF
ULF
EN Type
Type 1
None
None
None
None
Pull High
Pull High
Type 2
High Active
Low Active
High Active
Low Active
High Active
Low Active
Discharge
Fast
Fast
Normal
Normal
Fast
Fast
EEE
CODE
UHN
ULN
DHF
DLF
DHN
DLN
EN Type
Type 1
Pull High
Pull High
Pull Low
Pull Low
Pull Low
Pull Low
Type 2
High Active
Low Active
High Active
Low Active
High Active
Low Active
Discharge
Normal
Normal
Fast
Fast
Normal
Normal
Block Diagram
Absolute Maximum Ratings
Parameter
Input Voltage V
IN
to GND
Output Current Limit, I
(LIMIT)
Junction Temperature
Thermal Resistance
SOT‐25
SC‐70‐5
SOP‐8
SOT‐25
SC‐70‐5
SOP‐8
Symbol
V
IN
I
LIMIT
T
J
θ
JA
Ratings
9.0
1.0
+155
155
333
60
350
250
1670
‐40 ~ +85
‐55~+150
+260
Units
V
A
o
C
o
C/W
Power Dissipation
P
D
T
OPR
T
STG
‐
mW
o
o
Operating Ambient Temperature
Storage Temperature
Lead Temperature (soldering, 10sec)
C
C
o
C
NOTES:
1
The power dissipation values are based on the condition that junction temperature T
J
and ambient temperature T
A
difference is
100°C.
2
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended
operating conditions” is not implied. Exposure to absolute‐maximum –rated conditions for extended periods may affect device
reliability.
DS‐RS7302‐02
September, 2009
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