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Soldering Methods for Orister’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface‐mount devices
Figure 1: Temperature profile
t
P
Critical Zone
to T
TP
T
L
P
Ramp-up
TL
t
L
Tsmax
Tsmin
t
S
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Average ramp‐up rate (TL to TP)
Preheat
Sn‐Pb Eutectic Assembly
Pb‐Free Assembly
<3oC/sec
<3oC/sec
‐ Temperature Min (Tsmin
)
100oC
150oC
150oC
200oC
‐ Temperature Max (Tsmax
‐ Time (min to max) (ts)
Tsmax to TL
)
60~120 sec
60~180 sec
‐ Ramp‐up Rate
<3oC/sec
<3oC/sec
Time maintained above:
‐ Temperature (TL)
‐ Time (tL)
183oC
217oC
60~150 sec
240oC +0/‐5oC
60~150 sec
260oC +0/‐5oC
Peak Temperature (TP)
Time within 5oC of actual Peak
10~30 sec
20~40 sec
Temperature (tP)
Ramp‐down Rate
Time 25oC to Peak Temperature
<6oC/sec
<6oC/sec
<6 minutes
<8 minutes
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Peak temperature
245oC ±5oC
260oC +0/‐5oC
Dipping time
5sec ±1sec
5sec ±1sec
Pb‐Free devices.
DS‐RS7215‐02 September, 2009
www.Orister.com
ORISTER [ ORISTER CORPORATION ]
