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Absolute Maximum Ratings
Parameter
Input Voltage VIN to GND
Output Current Limit, I
(LIMIT)
Junction Temperature
Thermal Resistance
Power Dissipation
SOT‐223
TO‐252
SOT‐223
TO‐252
Symbol
V
IN
I
LIMIT
T
J
θ
JA
P
D
T
OPR
T
STG
‐
Ratings
9.0
2.0
+155
155
90
900
1200
‐40 ~ +85
‐55~+150
+260
Units
V
A
o
C
o
C/W
mW
o
o
Operating Ambient Temperature
Storage Temperature
Lead Temperature (soldering, 10sec)
C
C
o
C
NOTE:
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute‐maximum–rated conditions for extended periods may affect device reliability.
Electrical Characteristics
(T
A
=25°C, unless otherwise specified)
Symbol
V
IN
V
OUT
I
MAX
I
LIMIT
I
SC
I
Q
V
DROP
Parameter
Input Voltage
Output Voltage
Output Current (see NOTE)
Current Limit
Short Circuit Current
Ground Pin Current
Dropout Voltage
Conditions
‐
V
IN
=V
OUT
+1.0V, I
OUT
=1mA, V
OUT
≧1.8V
V
IN
=V
OUT
+1.0V, I
OUT
=1mA, V
OUT
<1.8V, V
IN
>2.4V
‐
‐
‐
I
LOAD
=0mA to 1.5A, V
IN
= V
OUT
+5.0V
I
OUT
=100mA, V
OUT
>2.4V
I
OUT
=500mA, V
OUT
>2.4V
I
OUT
=900mA, V
OUT
>2.4V
I
OUT
=1500mA, V
OUT
>2.4V
V
OUT
+1.0V≦V
IN
≦7.0V, I
OUT
=1mA
For Fixed Voltage Type
V
IN
=V
OUT
+1V, 1mA≦I
OUT
≦100mA
I
OUT
=100mA , F=1KHz, C
OUT
=10uF
I
OUT
=30mA, F=1KHz, C
OUT
=10uF
‐
‐
Min.
2.4
‐2%
‐35
1.5
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
‐
Typ.
‐
V
OUT
‐
1.8
1.0
40
30
230
500
900
0.2
0.01
40
55
160
10
Max.
7.0
+2%
+35
‐
‐
‐
65
45
350
750
1350
0.3
0.02
‐
‐
‐
‐
Unit
V
V
mV
A
A
A
uA
mV
ΔV
LINE
ΔV
LOAD
e
N
PSRR
T
SD
T
HYS
Line Regulation
Load Regulation
Output Noise
Ripple Rejection
Thermal Shutdown
Temperature
Thermal Shutdown Hysteresis
%/V
%/mA
uV
(rms)
dB
o
o
C
C
NOTE:Measured using a double sided board with 1”x2” square inches of copper area connected to the GND pins for “heat spreading”.
DS‐RS7110‐03
September, 2009
www.Orister.com