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Absolute Maximum Ratings
Parameter
Input Voltage VIN to GND
Output Current Limit, I(LIMIT)
Junction Temperature
Symbol
VIN
ILIMIT
TJ
θJA
PD
TOPR
TSTG
‐
Ratings
10
500
+155
250
Units
V
mA
oC
Thermal Resistance
Power Dissipation
SOT‐25
SOT‐25
oC/W
mW
oC
400
Operating Ambient Temperature
Storage Temperature
Lead Temperature (soldering, 10sec)
‐40 ~ +85
‐55~+150
+260
oC
oC
NOTE: Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute‐maximum–rated conditions for extended periods may affect device reliability.
Electrical Characteristics (TA=25°C, unless otherwise specified)
Symbol
VIN
VOUT
IMAX
ILIMIT
ISC
Parameter
Input Voltage
Output Voltage
Conditions
Min.
2.5
‐2%
300
‐
‐
‐
‐
Typ.
‐
VOUT
‐
0.5
260
40
60
0.1
‐
Max.
9.0
+2%
‐
Unit
V
V
mA
A
mA
‐
VIN=VOUT+1.0V, IOUT=30mA
VOUT+1.0V≦VIN≦9.0V
Output Current (see NOTE 1)
Current Limit
‐
‐
Short Circuit Current
VIN= VEN=5V, VOUT=0V
VIN= VEN=5V, No Load
VIN= VEN=9V, No Load
VIN=VOUT+1V, VEN=0V, No Load
(see NOTE 2)
300
60
100
1.0
‐
0.5
0.1
480
0.3
0.03
‐
IQ
Ground Pin Current
uA
ISD
VIH
VIL
Shutdown Current
EN Pin Input Voltage “H”
EN Pin Input Voltage “L”
EN Pin Leakage Current
Dropout Voltage
‐
uA
V
V
uA
mV
%/V
%/mA
uV(rms)
2.0
(see NOTE 2)
‐
‐
‐
‐
‐
‐
‐
‐
IEN
VDROP
ΔVLINE
ΔVLOAD
eN
400
0.2
0.02
40
IOUT=300mA
Line Regulation
Load Regulation
Output Noise
VOUT+0.5V≦VIN≦9.0V, IOUT=30mA
VIN=VOUT+1.0V, 0μA≦IOUT≦100mA
IOUT=100mA , F=1KHz, COUT=10uF
VIN=VOUT+1V, IOUT=30mA, F=100Hz, Vripple=1VP‐
PSRR
Ripple Rejection
‐
60
‐
dB
P
TSD
THYS
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
‐
‐
‐
‐
160
10
‐
‐
oC
oC
NOTES:
1. Measured using a double sided board with 1”x 2” square inches of copper area connected to the GND pins for “heat spreading”.
2. EN pin input voltage must be always less than or equal to input voltage.
DS‐RS7103‐02 September, 2009
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