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SOT-223 Dimension
DIM
A
B
C
D
Min.
2.90
6.70
3.30
0.60
Max.
3.10
7.30
3.70
0.80
Marking:
A
Pb Free Mark
.
(Note)
Pb-Free: "
"
R S
S J
Normal: None
1 1 1 7
-
Product Series
(ADJ,1.8,2.5,3.3,5)
E
F
G
H
I
*2.30
6.30
1.40
0.25
0.02
*13o
0 o
-
Control Code
Date Code
B
C
6.70
1.80
0.35
0.10
-
1
2
F
3
Note: Green label is used for Pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
a1
a2
D
E
Material:
10 o
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
*: Typical, Unit: mm
a1
H
I
G
a2
3-Lead SOT-223 Plastic
Surface Mounted Package
Package Code: SJ
SOT-89 Dimension
DIM
A
B
C
D
E
Min.
4.40
4.05
1.50
2.40
0.36
*1.50
*3.00
1.40
0.35
Max.
4.60
4.25
1.70
2.60
0.51
-
Marking:
C
H
Date Code
Control Code
Pb Free Mark
(Note)
.
Pb-Free: "
"
RS 1 1 1 7
Normal: None
D
B
Product Series
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
1
2
3
F
G
H
I
-
Note: Green label is used for Pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
1.60
0.41
I
E
F
*: Typical, Unit: mm
Material:
G
A
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead SOT-89 Plastic
Surface Mounted Package
Package Code: M
DS-RS1117-04 Dec, 2007
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ORISTER [ ORISTER CORPORATION ]
