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TIP50 参数 Datasheet PDF下载

TIP50图片预览
型号: TIP50
PDF下载: 下载PDF文件 查看货源
内容描述: 高压硅NPN功率晶体管 [High Voltage NPN Silicon Power Transistors]
分类和应用: 晶体晶体管开关高压局域网
文件页数/大小: 6 页 / 154 K
品牌: ONSEMI [ ON SEMICONDUCTOR ]
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TIP47G, TIP48G, TIP50G
High Voltage NPN Silicon
Power Transistors
This series is designed for line operated audio output amplifier,
SWITCHMODEt power supply drivers and other switching
applications.
Features
http://onsemi.com
250 V to 400 V (Min)
V
CEO(sus)
1 A Rated Collector Current
Popular TO−220 Plastic Package
These Devices are Pb−Free and are RoHS Compliant*
MAXIMUM RATINGS
Rating
Collector
Emitter Voltage
Collector
Base Voltage
Emitter
Base Voltage
Collector Current
Continuous
Peak
Base Current
Total Power Dissipation
@ T
C
= 25_C
Derate above 25_C
Total Power Dissipation
@ T
C
= 25_C
Derate above 25_C
Unclamped Inducting Load
Energy (See Figure 8)
Operating and Storage
Junction Temperature Range
Symbol
V
CEO
V
CB
V
EB
I
C
TIP47
250
350
TIP48
300
400
5.0
1.0
2.0
0.6
40
0.32
2.0
0.016
20
−65
to +150
TIP50
400
500
Unit
Vdc
Vdc
Vdc
Adc
1.0 AMPERE
POWER TRANSISTORS
NPN SILICON
250−300− 400 VOLTS
40 WATTS
MARKING
DIAGRAM
4
TIPxxG
AYWW
I
B
P
D
Adc
1
W
W/_C
W
W/_C
mJ
_C
2
3
TIPxx
xx
A
Y
WW
G
TO−220AB
CASE 221A
STYLE 1
P
D
E
T
J
, T
stg
= Device Code
= 47, 48, or 50
= Assembly Location
= Year
= Work Week
= Pb−Free Package
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
Junction−to−Case
Thermal Resistance,
Junction−to−Ambient
Symbol
R
qJC
R
qJA
Max
3.125
62.5
Unit
°C/W
°C/W
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2010
April, 2010
Rev. 8
1
Publication Order Number:
TIP47/D