SS26
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance − Junction−to−Lead (Note 1)
Thermal Resistance − Junction−to−Ambient (Note 2)
R
q
24
80
°C/W
q
JL
R
JA
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
ELECTRICAL CHARACTERISTICS
Value
T = 25°C
J
T = 125°C
J
Characteristic
Symbol
Unit
v
0.51
0.63
0.475
0.55
V
Maximum Instantaneous Forward Voltage (Note 3)
F
(i = 1.0 A)
F
F
(i = 2.0 A)
Maximum Instantaneous Reverse Current (Note 3)
I
0.2
10
mA
R
(V = 60 V)
R
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%.
10
10
75°C
75°C
25°C
125°C
25°C
125°C
1
1
0.1
100
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.0E−02
125°C
75°C
25°C
f = 1 MHz
1.0E−03
1.0E−04
1.0E−05
25°C
1.0E−06
1.0E−07
10
0
10
20
30
40
50
60
0
10
20
30
40
50
60
V , REVERSE VOLTAGE (V)
R
V , REVERSE VOLTAGE (V)
R
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
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