NUF6105FC
Printed Circuit Board Recommendations
Parameter
PCB Pad Size
Pad Shape
Pad Type
Solder Mask Opening
Solder Stencil Thickness
Stencil Aperture
Solder Flux Ratio
Solder Paste Type
Trace Finish
Trace Width
500
mm
Pitch
300
mm
Solder Ball
250
mm
+25
250
mm
−0
Round
NSMD
350
mm
±25
125
mm
250 x 250
mm
sq.
50/50
No Clean Type 3 or Finer
OSP Cu
150
mm
Max
Copper
Solder Mask
NSMD
SMD
Figure 7. Solder Mask versus Non−Solder Mask Definition
Controlled Atmosphere
250
225°C Min
235°C Max
200
TEMPERATURE (°C)
183
°C
150
140 to 160
°C
100
2 to 5
°C/s
50
0
0
1 to 5
°C/s
1
2
3
4
5
1 to 2 min
30−100 sec
TIME (minutes)
Figure 8. Solder Reflow Profile
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