NTZD3155C
Small Signal MOSFET
Complementary 20 V, 540 mA / -430 mA,
with ESD protection, SOT-563 package.
Features
http://onsemi.com
I
D
Max
(Note 1)
•
•
•
•
•
•
•
•
•
•
•
Leading Trench Technology for Low R
DS(on)
Performance
High Efficiency System Performance
Low Threshold Voltage
ESD Protected Gate
Small Footprint 1.6 x 1.6 mm
These are Pb-Free Devices
V
(BR)DSS
N-Channel
20 V
R
DS(on)
Typ
0.4
W
@ 4.5 V
0.5
W
@ 2.5 V
0.7
W
@ 1.8 V
0.5
W
@ -4.5 V
540 mA
Applications
P-Channel
-20 V
0.6
W
@ -2.5 V
1.0
W
@ -1.8 V
-430 mA
DC-DC Conversion Circuits
Load/Power Switching with Level Shift
Single or Dual Cell Li-Ion Battery Operated Systems
High Speed Circuits
Cell Phones, MP3s, Digital Cameras, and PDAs
PINOUT: SOT-563
S
1
1
6
D
1
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise specified)
Parameter
Drain-to-Source Voltage
Gate-to-Source Voltage
N-Channel
Continuous Drain
Current (Note 1)
P-Channel
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady
State
t
v
5s
Steady
State
t
v
5s
Steady
State
t
v
5s
Pulsed Drain Current
N-Channel
P-Channel
t
p
= 10
ms
I
DM
T
J
,
T
STG
I
S
T
L
T
A
= 25°C
T
A
= 85°C
T
A
= 25°C
T
A
= 25°C
T
A
= 85°C
T
A
= 25°C
T
A
= 25°C
P
D
280
1500
-750
-55 to
150
350
260
mA
°C
mA
°C
I
D
Symbol
V
DSS
V
GS
Value
20
±6
540
390
570
-430
-310
-455
250
mW
mA
Unit
V
V
G
1
2
5
G
2
D
2
3
Top View
4
S
2
6
1
SOT-563-6
CASE 463A
TW
M
G
MARKING
DIAGRAM
TW M
G
G
= Specific Device Code
= Date Code
= Pb-Free Package
(Note: Microdot may be in either location)
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
ORDERING INFORMATION
Device
NTZD3155CT1G
Package
SOT-563
(Pb-Free)
SOT-563
(Pb-Free)
SOT-563
(Pb-Free)
Shipping
†
4000 / Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface-mounted on FR4 board using 1 in sq. pad size
(Cu area = 1.127 in sq [1 oz] including traces).
NTZD3155CT2G
4000 / Tape & Reel
NTZD3155CT5G
8000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2007
1
May, 2007 - Rev. 2
Publication Order Number:
NTZD3155C/D