NL7WB66
DEVICE JUNCTION TEMPERATURE VS. TIME TO
0.1% BOND FAILURES
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Junction
Temperature 5C
Time, Hours
Time, Years
80
90
100
110
1,032,200
419,300
178,700
79,600
117.8
47.9
20.4
9.4
1
120
130
140
37,000
17,800
8,900
4.2
2.0
1.0
1
10
100
1000
TIME, YEARS
Figure 2. Failure Rate vs. Time Junction Temperature
DC CHARACTERISTICS − Digital Section (Voltages Referenced to GND)
Guaranteed Max Limit
−40 to
855C
−55 to
<1255C
255C
Symbol
Parameter
Condition
V
Unit
CC
V
IH
High−level Input Voltage,
Control Input
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
V
x 0.65
V
x 0.65
V x 0.65
V
CC
CC
CC
V
x 0.7
x 0.7
x 0.7
V
x 0.7
x 0.7
x 0.7
V
x 0.7
x 0.7
x 0.7
CC
CC
CC
CC
CC
CC
CC
CC
CC
V
V
V
V
V
V
V
IL
Low−level Input Voltage,
Control Input
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
V
x 0.35
x 0.3
x 0.3
x 0.3
V
x 0.35
x 0.3
x 0.3
x 0.3
V
CC
x 0.35
x 0.3
x 0.3
x 0.3
V
CC
CC
V
V
V
CC
CC
CC
CC
CC
CC
CC
CC
CC
V
V
V
V
V
V
I
Maximum Input Leakage
Current, Enable Inputs
V
= 5.5 V or GND
0 V to 5.5 V
+0.1
+1.0
+1.0
ꢂ A
ꢂ A
IN
IN
I
Maximum Quiescent
Supply Current
(per package)
Enable and VIS = VCC
or GND
5.5
1.0
1.0
2.0
CC
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