MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFNW10, 3x3, 0.5P
CASE 507AG
ISSUE B
1
DATE 14 APR 2020
SCALE 2:1
GENERIC
MARKING DIAGRAM*
1
XXXXX
XXXXX
ALYWG
G
XXXXX = Specific Device Code
A
L
= Assembly Location
= Wafer Lot
Y
W
G
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON73716G
DFNW10, 3x3, 0.5P
PAGE 1 OF 1
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