NCP5007
PACKAGE DIMENSIONS
TSOP−5
SN SUFFIX
CASE 483−02
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
D
5
4
3
B
C
S
1
2
L
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
G
A
B
C
D
G
H
J
K
L
M
S
2.90
1.30
0.90
0.25
0.85
3.10 0.1142 0.1220
1.70 0.0512 0.0669
1.10 0.0354 0.0433
0.50 0.0098 0.0197
1.05 0.0335 0.0413
A
J
0.013 0.100 0.0005 0.0040
0.05 (0.002)
0.10
0.20
1.25
0
0.26 0.0040 0.0102
0.60 0.0079 0.0236
1.55 0.0493 0.0610
H
M
K
10
0
10
_
_
_
_
2.50
3.00 0.0985 0.1181
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
21
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