NCP1117, NCV1117
PACKAGE DIMENSIONS
SOT−223
ST SUFFIX
CASE 318H−01
ISSUE O
0.08
NOTES:
E
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.23 PER
SIDE.
4. DIMENSIONS b AND b2 DO NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS
OF THE b AND b2 DIMENSIONS AT MAXIMUM
MATERIAL CONDITION.
M
S
0.2
C B
C
H
B
3
2
e
A
e1
A
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS D AND E1 ARE TO BE DETERMINED
AT DATUM PLANE H.
4
B
1
b2
0.1
A1
A
MILLIMETERS
E1
B
DIM MIN
MAX
1.80
0.11
0.88
0.80
3.10
3.05
0.35
0.30
6.70
7.30
3.70
A
M
S
S
B
A
C
A
A1
b
−−−
0.02
0.60
0.60
2.90
2.90
0.24
0.24
6.30
6.70
3.30
b1
b2
b3
c
(b)
b1
(b2)
c
c1
c1
D
T
E
E1
e
b3
2.30
4.60
SECTION B−B
L
SECTION A−A
e1
L
−−−
10
0.25
0
T
_
_
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
6.3
0.248
2.3
0.091
2.3
0.091
2.0
0.079
mm
inches
ǒ
Ǔ
1.5
0.059
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
14
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