MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
DATE 18 JAN 2018
SCALE 2:1
5X b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
0.20 C A B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
M
5
4
E1
E
1
2
3
0.05
A1
L
B
e
DETAIL A
A
D
MILLIMETERS
DIM
A
A1
b
c
D
E
E1
e
MIN
0.90
0.01
0.25
0.10
2.85
2.50
1.35
MAX
1.10
0.10
0.50
0.26
3.15
3.00
1.65
TOP VIEW
SIDE VIEW
A
DETAIL A
c
0.95 BSC
SEATING
PLANE
END VIEW
C
L
M
0.20
0
0.60
10
_
_
RECOMMENDED
GENERIC
SOLDERING FOOTPRINT*
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
= Specific Device Code
= Date Code
2.40
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
PAGE 1 OF 1
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