NBSG72A
PACKAGE DIMENSIONS
16 PIN QFN
MN SUFFIX
CASE 485G−01
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
D
A
B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN 1
LOCATION
5.
L
CONDITION CAN NOT VIOLATE 0.2 MM
max
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
E
MILLIMETERS
DIM MIN
0.80
A1 0.00
MAX
1.00
0.05
A
0.15
C
A3
b
D
0.20 REF
TOP VIEW
0.18
0.30
0.15
C
3.00 BSC
D2 1.65
1.85
1.85
E
3.00 BSC
(A3)
E2 1.65
0.10
0.08
C
C
e
K
L
0.50 BSC
0.20
0.30
−−−
0.50
A
SEATING
PLANE
16 X
SIDE VIEW
D2
A1
C
e
L
16X
EXPOSED PAD
5
8
NOTE 5
4
9
E2
e
K
16X
12
1
16
13
16X b
0.10
0.05
C
C
A
B
BOTTOM VIEW
NOTE 3
SOLDERING FOOTPRINT*
3.25
0.128
0.30
0.575
0.022
EXPOSED PAD
0.012
1.50
0.059
3.25
0.128
0.30
0.012
0.50
0.02
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
15
ONSEMI [ ONSEMI ]
