MURA130T3, MURA140T3
Preferred Devices
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
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Features
• Small Compact Surface Mountable Package with J−Bend Leads
• Rectangular Package for Automated Handling
ULTRAFAST RECTIFIERS
1 AMPERE, 300−400 VOLTS
• High Temperature Glass Passivated Junction
• Low Forward Voltage Drop (0.8 V Max @ 1.0 A, T = 150°C)
J
• Pb−Free Packages are Available
Mechanical Characteristics:
• Case: Epoxy, Molded
SMA
CASE 403D
PLASTIC
• Weight: 70 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
MARKING DIAGRAM
• Polarity: Polarity Band Indicates Cathode Lead
• ESD Protection: Human Body Model > 4000 V (Class 3)
Machine Model > 400 V (Class C)
U4x
AYWW G
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
V
V
U4x = Device Code
x = F for MURA130T3
= G for MURA140T3
RRM
V
RWM
V
DC Blocking Voltage
MURA130T3
MURA140T3
300
400
R
A
Y
= Assembly Location
= Year
Average Rectified Forward Current
I
A
A
F(AV)
WW = Work Week
@ T = 150°C
1.0
2.0
L
@ T = 125°C
G
= Pb−Free Package
L
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Condtions
Halfwave, Single Phase, 60 Hz)
I
35
FSM
ORDERING INFORMATION
†
Device
Package
Shipping
Operating Junction Temperature Range
T
J
−65 to +175 °C
MURA130T3
SMA
5000/Tape & Reel
5000/Tape & Reel
THERMAL CHARACTERISTICS
MURA130T3G
SMA
(Pb−Free)
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Lead
Psi
24
°C/W
JL
(T = 25°C) (Note 1)
(Note 2)
MURA140T3
SMA
5000/Tape & Reel
5000/Tape & Reel
L
Thermal Resistance, Junction−to−Ambient
(Note 1)
R
216
θ
JA
MURA140T3G
SMA
(Pb−Free)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. Rating applies when surface mounted on the minimum pad size recommended,
PC Board FR−4.
Preferred devices are recommended choices for future use
and best overall value.
2. In compliance with JEDEC 51, these values (historically represented by R
)
θ
JL
are now referenced as Psi
.
JL
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 4
MURA130T3/D
ONSEMI [ ONSEMI ]
