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MPSA56ZL1G 参数 Datasheet PDF下载

MPSA56ZL1G图片预览
型号: MPSA56ZL1G
PDF下载: 下载PDF文件 查看货源
内容描述: 放大器晶体管 [Amplifier Transistors]
分类和应用: 晶体放大器晶体管
文件页数/大小: 7 页 / 90 K
品牌: ONSEMI [ ONSEMI ]
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NPN − MPSA05, MPSA06*;  
PNP − MPSA55, MPSA56*  
*Preferred Devices  
Amplifier Transistors  
Voltage and Current are Negative  
for PNP Transistors  
http://onsemi.com  
Features  
NPN  
PNP  
Pb−Free Packages are Available*  
COLLECTOR  
3
COLLECTOR  
3
MAXIMUM RATINGS  
2
2
BASE  
BASE  
Rating  
Symbol  
Value  
Unit  
CollectorEmitter Voltage  
V
CEO  
V
CBO  
V
EBO  
Vdc  
1
1
MPSA05, MPSA55  
MPSA06, MPSA56  
60  
80  
EMITTER  
EMITTER  
CollectorBase Voltage  
Vdc  
MPSA05, MPSA55  
MPSA06, MPSA56  
60  
80  
EmitterBase Voltage  
4.0  
Vdc  
TO−92  
Collector Current − Continuous  
I
500  
mAdc  
CASE 29  
STYLE 1  
C
Total Device Dissipation @ T = 25°C  
P
625  
5.0  
W
mW/°C  
A
D
Derate above 25°C  
1
1
2
2
Total Device Dissipation @ T = 25°C  
P
1.5  
12  
W
mW/°C  
C
D
3
3
Derate above 25°C  
STRAIGHT LEAD  
BULK PACK  
BENT LEAD  
TAPE & REEL  
AMMO PACK  
Operating and Storage Junction  
Temperature Range  
T , T  
J
−55 to +150  
°C  
stg  
THERMAL CHARACTERISTICS  
Characteristic  
MARKING DIAGRAM  
Symbol  
Max  
Unit  
Thermal Resistance, Junction−to−Ambient  
(Note 1)  
R
200  
°C/W  
q
JA  
Thermal Resistance, Junction−to−Case  
R
83.3  
°C/W  
q
JC  
MPS  
Axx  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
AYWW G  
G
1. R  
is measured with the device soldered into a typical printed circuit board.  
q
JA  
xx  
A
Y
= 05, 06, 55, or 56  
= Assembly Location  
= Year  
WW = Work Week  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Preferred devices are recommended choices for future use  
and best overall value.  
© Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
April, 2007 − Rev. 3  
MPSA05/D  
 
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