MMSZ5221BT1 Series
Preferred Device
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
Features
http://onsemi.com
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500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range − 2.4 V to 110 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
General Purpose, Medium Current
ESD Rating of Class 3 (>16 kV) per Human Body Model
Pb−Free Packages are Available
1
1
Cathode
2
Anode
2
SOD−123
CASE 425
STYLE 1
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
MARKING DIAGRAM
260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
1
xx M
G
G
MAXIMUM RATINGS
Rating
Total Power Dissipation on FR−5 Board,
(Note 1) @ T
L
= 75°C
Derated above 75°C
Thermal Resistance, Junction−to−Ambient
(Note 2)
Thermal Resistance, Junction−to−Lead
(Note 2)
Junction and Storage Temperature Range
Symbol
P
D
500
6.7
R
qJA
R
qJL
T
J
, T
stg
340
150
−55 to +150
mW
mW/°C
°C/W
°C/W
°C
Max
Unit
xx = Device Code (Refer to page 3)
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MMSZ52xxBT1
MMSZ52xxBT1G
MMSZ52xxBT3
MMSZ52xxBT3G
Package
SOD−123
SOD−123
(Pb−Free)
SOD−123
SOD−123
(Pb−Free)
Shipping
†
3000/Tape & Reel
3000/Tape & Reel
10000/Tape & Reel
10000/Tape & Reel
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
Devices listed in
bold, italic
are ON Semiconductor
Preferred
devices.
Preferred
devices are recommended
choices for future use and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
January, 2006 − Rev. 7
Publication Order Number:
MMSZ5221BT1/D
ONSEMI [ ON SEMICONDUCTOR ]
