MC78M00, MC78M00A Series
DEFINITIONS
Line Regulation
− The change in output voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Load Regulation
− The change in output voltage for a
change in load current at constant chip temperature.
Maximum Power Dissipation
− The maximum total
device dissipation for which the regulator will operate
within specifications.
Input Bias Current
− That part of the input current that
is not delivered to the load.
Output Noise Voltage
− The rms AC voltage at the
output, with constant load and no input ripple, measured
over a specified frequency range.
Long Term Stability
− Output voltage stability under
accelerated life test conditions with the maximum rated
voltage listed in the devices’ electrical characteristics and
maximum power dissipation.
R
θ
JA, THERMAL RESISTANCE
90
80
70
60
50
JUNCTION−TO−AIR (
°
C/W)
Free Air
Mounted
Vertically
Minimum
Size Pad
P
D(max)
for T
A
= 50°C
2.0
2.0 oz. Copper
L
L
1.6
1.2
0.8
0.4
R
qJA
40
0
5.0
10
15
20
25
0
30
L, LENGTH OF COPPER (mm)
Figure 2. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
10
PD, POWER DISSIPATION (W)
5.0
3.0
2.0
1.0
0.5
0.3
0.2
0.1
25
q
JC
= 5°C/W
P
D(max)
= 7.52 W
50
75
100
125
150
T
A
, AMBIENT TEMPERATURE (°C)
q
HS
= 20°C/W
No Heat Sink
q
HS
= 10°C/W
Infinite Heat
Sink
Figure 3. Worst Case Power Dissipation
versus Ambient Temperature (TO−220)
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7
PD, MAXIMUM POWER DISSIPATION (W)
100
2.4
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ONSEMI [ ON SEMICONDUCTOR ]
