MC7800, MC7800A, NCV7805
PACKAGE DIMENSIONS
2
D PAK−3
D2T SUFFIX
CASE 936−03
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
TERMINAL 4
−T−
OPTIONAL
CHAMFER
K
E
A
U
S
V
B
H
F
INCHES
DIM MIN MAX
MILLIMETERS
MIN MAX
9.804 10.236
1
2
3
M
L
A
B
C
D
E
F
0.386
0.356
0.170
0.026
0.045
0.403
0.368
0.180
0.036
0.055
9.042
4.318
0.660
1.143
9.347
4.572
0.914
1.397
J
D
P
N
G
0.010 (0.254) M
T
0.051 REF
0.100 BSC
0.539 0.579 13.691 14.707
0.125 MAX
0.050 REF
0.000
0.088
0.018
0.058
1.295 REF
2.540 BSC
R
G
H
J
3.175 MAX
1.270 REF
K
L
0.010
0.102
0.026
0.078
0.000
0.254
2.591
0.660
1.981
M
N
P
R
S
U
V
2.235
0.457
1.473
C
SOLDERING FOOTPRINT*
5_REF
5_REF
0.116 REF
0.200 MIN
0.250 MIN
2.946 REF
5.080 MIN
6.350 MIN
8.38
0.33
1.016
0.04
10.66
0.42
5.08
0.20
3.05
0.12
17.02
0.67
mm
inches
ǒ
Ǔ
SCALE 3:1
2
D PAK−3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
30
ONSEMI [ ONSEMI ]
